国家/地区 中国（3）
IPC部 C（3）
IPC大类 C01（3）
IPC小类 C01B（3）
IPC
发明人 JI H（3）
公开年
申请年
专利权人

Cooling mechanism of processing device of graphene comprises shell and furnace body, where top of two sides of shell is provided with mounting hole, and inner part of two mounting holes are fixedly connected with outer surface of furnace body.

JI H

Heat-conducting column used in heat-dissipation structure of light-emitting diode lamp, comprises water-absorbing layer coated with carbon fiber layer which is coated with graphene layer.

CHEN D, JI H

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K