国家/地区 中国（3）
IPC部 C（3）
IPC大类 C01（3） F21（3）
IPC小类 C01B（3）
IPC F21Y115/10（3）
发明人
公开年 2022（2）
申请年 2021（2） 
专利权人

Use of graphene film as high temperature resistant thermal interface material or heat dissipation film material.

CHENG H, LIU H, MA C, REN W

Preparation of aluminum alloy composite heat dissipation material containing carbide/graphene sandwich structure for LED lamp, involves adding nickel nitrate nonahydrate into ethanol, and adding prepared nitrate ethanol solution to resin.

WANG Z, XU J, HUANG J

Heat-conducting column used in heat-dissipation structure of light-emitting diode lamp, comprises water-absorbing layer coated with carbon fiber layer which is coated with graphene layer.

CHEN D, JI H