国家/地区 中国（2）
IPC部 C（2） H（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Forming layer, comprises e.g. exposing substrate to aromatic precursor in processing chamber, rinsing aromatic precursor from processing chamber, and heating substrate deposit graphene hard mask layer on substrate.

BHUYAN B J, LEONCINI A

Electrical interconnect component comprises connection part that is electrically conductive; and electrical contact on at least a part of a surface of connection part and comprising a graphene oxide film.

YE N, KUBO T, SHIMIZU T