国家/地区 世界知识产权组织（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC
发明人
公开年
申请年 2009（2）
专利权人

Grinding-and/or cutting disk for machining and cutting workpiece i.e. abrasive grain, has hardened corpus including grained abrasive, filler and polymer as binder matrix, where filler comprises expanded graphite and/or graphene.

TRAPP V, REMP M, LANGER W, ADASCH V, DEEKEN S

Forming graphene layer used in e.g. transistors, solar panels, involves mixing carbon source with molten solvent, precipitating carbon source from solvent to form graphite layer, and separating graphite layer into several graphene layers.

SUNG C, HU S C, LIN I, YU C, SONG J