国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08L063/00（3）
发明人
公开年 2012（2）
申请年 2011（3）
专利权人

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J

Method for preparing glass fiber/graphene-carbon nanotube/epoxy resin multi-dimensional hybrid composite material in e.g. airspace field, involves performing chemical cross linking reaction.

CHEN D, QIU J

Modified graphene/epoxy resin composite material comprises two-phase structure consisting of epoxy resin matrix main body, and black modified graphene as enhanced phase.

WANG Y, ZHENG H, ZHAO Y, DUAN Y, BAO T