国家/地区 世界知识产权组织（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08K003/22（2）
发明人
公开年
申请年
专利权人

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Polymeric material for two-portion composition, comprises a polymerized reaction product of a polymerizable composition comprising components, where components comprises a uretdione-containing material.

WHITE K L, YAO L, RULE J D, KRYGER M J, KROPP M A