国家/地区 中国（2）
IPC部 B（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08K003/04（2）
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Polyimide precursor solution comprises modified silica microsphere, graphene oxide, diamine compound and dianhydride solution where modified silica microsphere is prepared by using silica powder as carrier, adding pure water under protection of inert gas to obtain initial product.

YUAN B