国家/地区 中国（2） 美国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08K003/08（2）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Conductive material used in electronic device, comprises first component, where first component comprises liquid metal with melting point below room temperature, coating material and first solvent, and second component.

DONG S