国家/地区
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC
发明人
公开年
申请年
专利权人

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

Flexible material used for light-emitting diode lamp package, contains polyphenylene sulfide, polyvinyl chloride, N,N-methylenebisacrylamide, isocyanate, nano graphene, silane coupling agent and hindered amine light stabilizer.

LIU C