国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B017/02（2）
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H