国家/地区
IPC部 C（3）
IPC大类 C01（3）
IPC小类 C01B（3）
IPC
发明人
公开年 2023（3）
申请年 2021（3）
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Attaching nanomaterial comprising hexagonal lattice to polymer surface involves laminating polymer surface with amine groups, fictionalizing surfaces of nanomaterial with ester groups, reacting ester groups functionalized nanomaterial surfaces with amine groups, and chemically attaching nanomaterial.

VACKEL A, TREADWELL L J, REDLINE E M

Polymer modified graphene composite material useful in preparing a gas sensor comprises molybdenum disulfide, graphene, quantum graphene and polymer.

WANG Y, WU Z, YING S, HUANG M