国家/地区 日本（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B032/205（2）
发明人 SAWA K（2）
公开年
申请年 2015（2） 
专利权人 SEKISUI CHEM.（2）

Heat conductive sheet for electronic device casing, has layers comprising synthetic resin and carbon material of graphene laminated structure, and heat conductivities measured at different direction satisfying preset relation.

NAKAMURA K, SAWA K, KUSACHI K

Carbon material used for manufacture of resin compound material, comprises volatile component having graphene structure and volatilized at preset temperature.

SAWA K, HAMADA T, MUKOHATA D, INUI N