国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4） H01（2）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人
公开年 2013（2） 2014（2）
申请年 2012（4）
专利权人

Graphene-polyamide composite, where the graphene surface is modified with polyamide.

HAN J H, KIM H J

Polyamide resin composition for forming polyamide composite material, comprises modified polyolefin resin or its acid anhydride grafted with dicarboxylic acid, carbon system compound, polyamide resin, graphene and/or fullerene.

KWON S J, MA S W, CHO S M, HWANG T Y, QIANQIAN L

Polyamide composition, useful for producing a molded part, comprises polyamide, an electrically conductive carbon comprising carbon nanotubes and graphene, an oligofunctional compound, and optionally conventional auxiliaries and additives.

HAEGER H, WURSCHE R, HERMASCH S A, JAKISCH L, KRAUSE B, POETSCHKE P, SOCHER R, HEGEL H, JAKISH L, PERCHIK P, WUSHER R, KHERMASH Z A, YAKISH L, KRAUZE B, PECHKE P, ZOKHER R, HAGER H, POTSCHKE P, HAEGER H D, WURSCHE R D, HERMASCH S A D, JAKISCH L D, KRAUSE B D, POETSCHKE P D

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN