国家/地区 韩国（4） 美国（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08L101/00（4）
发明人 LEE H（2） LEE S（2）
公开年 2022（2）
申请年
专利权人 KOREA INST SCI TECHNOLOGY（4）

Carbon composite material useful for building materials for heating and and electronic industry and electronic devices, comprises polymer resin and carbon material.

YANG C M, KIM J H, LEE Y S, RYEOL K N, KIM S K, RYU J S, LEE M W, NA W, MINGOOK K, PARK H B

Filler composite material used for high voltage switchgear, comprises heterogeneous material composite particles including host and guest particles comprising zinc oxide, silicon dioxide, and aluminum oxide or silicate and polymer resin.

CHAE J, LEE S, KIM Y N, AHN S, WOO K, CHOI Y

Composite material used in manufacture of fused deposition modeling-type three-dimensional printer polymer filament, comprises specified amount of graphene-coated metal nanoparticles, nanocarbons and polymer resin.

HWANG J, PARK S G, LIM J S, JO W, LEE H J, MOON M, KU B, HWANG J Y, JO W J, MOON M W, KU B C, HUANG J, PARK S, LIN C, ZHAO Y, LEE H, YEON H J, GYU P S, SEONG I J, JIN C W, JU L H, UN M M, CHEOL G B, LIM J

Electroconductive particle comprising a polymer microparticle and graphene coating layer grafted on the polymer microparticle, useful in anisotropic conductive film for packaging electronic devices.

LEE S, KIM K, LIM S H, PARK M, KIM J K, KIM H, LEE H, KIM G, IM S, KIM J, KIM K H, KIM H S, YI S S, I H J, SU LEE S, SUK KIM H, JEONG LEE H, GYEONG KIM J, HO IM S, LEE S S