国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08J（2）
IPC C08K003/04（2）
发明人
公开年
申请年 2019（2）
专利权人

Preparing thermally conductive polymer composite material with multi-level continuous network structure by preparing network , soaking in dispersion, drying, soaking in polymer aqueous solution or polymer precursor solution, and drying.

QIN M, CHEN L

Thermally conductive polyimide film comprises imide compounds of polyamic acid, PTFE, nanocellulose, polyester resin, graphene, p-phenylenediamine, diphenylbutanedione, dipentaerythritol, potassium tetraborate and polypropylene.

SUN W, XU W, HOU M, SUN D, GAO B