国家/地区
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC
发明人 LAI C（2）
公开年
申请年
专利权人 LAI C（2）

Graphene inorganic high thermal conductivity heat dissipation coating in heat exchange device, comprises graphene powder, and elemental silicon system inorganic slurry comprising nano-elementary silicon, alcohol, coupling agent and water.

LAI C

Graphene baking varnish used to coat a metal surface, comprises graphene nanoflakes, heat dissipation fillers e.g. tin, dispersant i.e. nonionic or ionic dispersant, binders made of thermoplastic polymers, and carriers e.g. organic solvent.

LAI C, CHANG K, CHEN J