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IPC部
C(2)
IPC大类
C09(2)
IPC小类
C09D(2)
IPC
发明人
WU K(2)
公开年
2022(2)
申请年
专利权人
Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.
WU K, LI Y, CHANG C H, ZHU X
Epoxy resin composite anticorrosive coating used in steel structure, ship, port machinery, bridge and chemical storage tank, comprises epoxy resin, curing agent, filler and other auxiliary agents.
WU K, WU X
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