国家/地区 中国（2）
IPC部 C（2）
IPC大类 C01（2） C09（2）
IPC小类 C01B（2）
IPC C01B032/182（2）
发明人
公开年
申请年 2017（2）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparing graphene modified tungsten carbide self-lubricating and wear-resistant additive comprises placing mixed powder of graphene and tungsten-containing precursor in alumina crucible, vacuuming, insulating and cooling.

CUI Y, GAO J, GUO M, TANG Z, TIAN H, WANG C, ZHANG H, ZHOU Z