国家/地区 韩国（3）
IPC部 B（3）
IPC大类 C08（3） C09（3） C01（2）
H01（2）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年 2018（3）
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparation of binder slurry for electrode used in energy storage device, involves mixing halogenated graphene nanoplatelets having specific graphene layers, and polar solvents to form nanoplatelet slurry, and combining slurry and binders.

ZHANG Y, TANG Z

Plastic panel used as flooring material, comprises main component consisting of specified amount of waste plastic, graphene powder and pigment, and graphene film formed at center of main component and having through-holes.

BONG S P, DONG K K