国家/地区 世界知识产权组织（3）
IPC部 B（3）
IPC大类 B29（3）
IPC小类 B29C（3）
IPC C08K003/08（3）
发明人
公开年 2018（2）
申请年 2017（2） 
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Freeze-dried composition useful as ink of three-dimensional (3D) printer for producing 3D element or 3D figure comprises metal powder comprising gold, silver, platinum and rhodium, graphene, silica, resin, and biological sample of subject.

PRIETO G, LOPEZVALERA F R, SAIZ A, NARBON P G, SANCHEZGUITARD L, TERUEL S A, NARBON PRIETO G, SANCHEZGUITARD LOPEZVALERA, TERUEL SAIZ A, SANCHEZGUITARD L F

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q