国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08L（2）
IPC C09D011/107（2）
发明人
公开年 2021（2）
申请年
专利权人

Vacuum bag film with heating function used in packaging, includes vacuum film layer, conductive heating layer with carbon-based conductive material, binder, and solvent.

HU Z, HU J, CEN C, HU X

Graphene multilayer circuit board heating chip comprises epoxy resin glass fiber plate as substrate layer, electrode layer connected with graphene layer, and epoxy resin glass cloth as top layer.

CHEN L