国家/地区 日本（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08G（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人

Composition for coating and for forming a coating on substrate e.g., surface of boat or ship comprises epoxy-functional monomers, diluent, and sufficient amount of hydrophobicity-modifying additive that is reactive in epoxide polymerization.

GAIER M, ALGERMOZI M, RODIONOV I

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S