国家/地区 中国（3）
IPC部 B（3）
IPC大类 C09（3） B27（2）
IPC小类 C09D（3）
IPC C09J011/04（3）
发明人
公开年 2022（2）
申请年 2022（3）
专利权人

Heat-resistant and wear-resistant composite plate comprises high-temperature-resistant substrate, wear-resistant metal panel, heat-resistant adhesive layer and wear-resistant coating, heat-resistant adhesive layer includes heat-resistant adhesive layer compound.

ZHANG Y, RAN Y, XU J, DOU Q, ZU X

Preparing medium-density plate useful as e.g. backing board for printed circuit board drilling, comprises e.g. placing formaldehyde and methyl phenol into reactor, adding potassium hydroxide to reactant, mixing, heating, reacting, adding aminopropyltriethoxysilane, and reacting.

LI F

Special aerogel mixed slurry for e.g. partilce board, comprises aerogel powder, adhesive, viscosity enhancer, titanium dioxide and distilled water, and has preset viscosity.

ZHANG X