国家/地区
IPC部 B（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09J011/04（2）
发明人
公开年 2023（2）
申请年 2022（2） 
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Heat-resistant and wear-resistant composite plate comprises high-temperature-resistant substrate, wear-resistant metal panel, heat-resistant adhesive layer and wear-resistant coating, heat-resistant adhesive layer includes heat-resistant adhesive layer compound.

ZHANG Y, RAN Y, XU J, DOU Q, ZU X