国家/地区 中国（2）
IPC部 B（2）
IPC大类 B27（2） C09（2）
IPC小类 B27N（2）
IPC C09J011/04（2）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Preparing medium-density plate useful as e.g. backing board for printed circuit board drilling, comprises e.g. placing formaldehyde and methyl phenol into reactor, adding potassium hydroxide to reactant, mixing, heating, reacting, adding aminopropyltriethoxysilane, and reacting.

LI F

Special aerogel mixed slurry for e.g. partilce board, comprises aerogel powder, adhesive, viscosity enhancer, titanium dioxide and distilled water, and has preset viscosity.

ZHANG X