国家/地区 法国（3）
IPC部 B（3）
IPC大类 C09（3） H01（2）
IPC小类 C09D（3）
IPC
发明人
公开年 2021（2）
申请年
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Preparation of composite material with core-shell nanoparticles used as e.g. electrode in lithium battery, involves depositing ink comprising nanoparticles encapsulated in polymeric matrix on surface of substrate, and illuminating substrate covered with ink with pulsed light for dissociating carbon.

KASSEM O, RIEU M, VIRICELLE J, SAADAOUI M, OMAR K, MATHILDE R, JEANPAUL V, MOHAMED S

Electrically conductive composition used for decorative or building underlayer material, comprises base material, fluid binder and interactive powder material having preset particle size and electrical resistivity.

BARDOU M