国家/地区 世界知识产权组织（3） 美国（2）
IPC部 B（3）
IPC大类 B29（3）
IPC小类 B29C（3）
IPC C09D011/52（3）
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Fabrication of graphene-based circuits on substrate by preparing printable ink comprising graphene or graphene oxide exfoliated from graphite from bulk synthesis process, and aerosol jet printing circuit on substrate using printable ink.

RANGNEKAR S V, HERSAM M C, PARATE K, CLAUSSEN J

Producing reversible hemiaminal or aminal gel composition used in 3D printing, involves preparing liquid precursor composition, where liquid precursor composition operable to remain in first liquid state at about room temperature.

BOUL P