国家/地区 日本（3）
IPC部 B（3）
IPC大类 C09（3）
IPC小类 C09D（3）
IPC B82Y030/00（2）
发明人
公开年 2012（3）
申请年 2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Pencil lead for e.g. mechanical pencil, contains graphite and graphene nano ribbon contacting with ab surface of graphite.

ENDO M, KITAZAWA K, SAKANISHI S, SUDA Y

Manufacture of multilayer graphene-coated substrate used as e.g. transparent conductive film and electroconductive film, involves laminating multilayer graphene obtained from multilayer graphene assembly on surface of substrate.

MURAMATSU K