国家/地区 美国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC
发明人
公开年 2022（2）
申请年
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Coating comprises humic acid, particles of anti-corrosive pigment or sacrificial metal, and binder resin comprising UV radiation curable resin or lacquer.

JANG B Z, ZHAMU A, LIN Y