国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2） C25（2）
IPC小类 C09K（2）
IPC C09K005/14（2）
发明人
公开年
申请年 2021（2）
专利权人

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Phenylacetylene functionalized graphene/copper composite thermal conductive material, prepared by e.g. preparing phenylacetylene functionalized grapheme and adding into acidic copper sulfate solution under magnetic stirrer.

JIANG J, LI X, HUANG Y, WANG H, LI Q