国家/地区 中国（4）
IPC部 B（4）
IPC大类 C25（4） B29（2）
IPC小类 C25D（4）
IPC C25D015/00（4）
发明人 DING Y（2） ZHANG Q（2） ZHU Z（2）
公开年 2022（3）
申请年 2022（4）
专利权人

Silver-graphene composite plating layer, has layer main body provided with first nano-silver layer, silver-graphene layer and second nano-silver layer that are sequentially arranged on base body.

LI H, ZHAO K, ZHANG Q, CHEN B, GUO W, ZHU Z, ZHANG C, DING Y, PANG Z

Preparation of copper-tungsten graphene-containing composite material for vacuum switch electric appliance, involves preparing tungsten-copper-graphene core-shell powder, and sintering obtained graphene core shell powder.

DING Y, ZHU Z, LIANG S, ZOU J, XIAO P, CHEN Z, ZHANG Q, DENG N

Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.

JIANG B, QIANG J, SUN H, WANG Y, WENG C

Segmented annular wire saw for cutting e.g. crystal silicon, has annular bus, where external surface annular bus is interval with multiple sand plating sections, and chip discharging groove formed between adjacent two sand plating sections.

YOU L, ZHANG Y, GONG Y