国家/地区
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 LEE C（2）
公开年
申请年 2021（2）
专利权人

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q

Electrolytic copper foil used for lithium ion battery, comprises copper, chlorine element and rare-earth element.

PENG S, LIAO P, YE M, LI Q, ZHU E, LI Y, LIU J, BANG S, LIO P Y, LEE C, MASTER S, LEE J