国家/地区 中国（4）
IPC部 C（4）
IPC大类 C25（4）
IPC小类 C25D（4）
IPC C25D003/12（2）
发明人 LIU X（4）
公开年 2021（2） 2022（2）
申请年 2021（4）
专利权人 STATE GRID Z.（2）

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Preparing composite plating layer useful in preparing electric contact material, comprises e.g. taking composite plating solution as plating solution, carrying out electric brush plating on surface of substrate to obtain composite plating layer and composite plating solution is silver nitrate.

MAO R, JIA L, YU J, HU J, HE C, YE Z, LIU X, CHEN W, TIAN X, PEI F

Preparing graphene coating used in field of metal material surface anti-corrosion, composite material, solar battery, coating, and electro-deposition technology field, comprises e.g. adding graphene and metal salt into organic solvent, and ultrasonically processing.

ZU L, WANG D, BO L, LIU X

Preparing super-hydrophobic aluminum alloy comprises placing aluminum alloy sheet in electrodeposited metal nickel precursor, adding hydrophobic material, applying direct current, forming composite layer of metal oxide, and reducing.

MA A, CHEN Y, LIU X, HU Q, WANG J, HE W, WANG L