国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D003/12（2）
发明人 LIU X（2）
公开年
申请年 2021（2） 
专利权人

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Preparing super-hydrophobic aluminum alloy comprises placing aluminum alloy sheet in electrodeposited metal nickel precursor, adding hydrophobic material, applying direct current, forming composite layer of metal oxide, and reducing.

MA A, CHEN Y, LIU X, HU Q, WANG J, HE W, WANG L