国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 WANG J（2）
公开年 2022（2）
申请年
专利权人

Packaging carrier plate has alumina ceramic plate whose one surface has three-dimensional conical structure layer of alumina ceramic, where copper-graphene composite material layer is compounded on three-dimensional conical structure layer.

LIANG N, WU S, WANG J, SUN C, ZHANG D, ZHANG W, SONG X

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N