国家/地区 中国（8）
IPC部 C（8）
IPC大类 C25（8） C23（2）
IPC小类 C25D（8）
IPC C25D005/48（8）
发明人 GUO C（6） LAI H（6） CHEN M（3）
WU M（2）
公开年 2020（8）
申请年 2019（8）
专利权人 GUANGZHOU UL.（6）

Plating layer structure for sealing red copper and nano graphene, comprises metal substrate, cyanide pre-plating copper layer, middle copper plating layer, bright copper plating layer, gun black tin nickel alloy plating layer and graphene sealing layer.

GUO C, CHEN M, LAI H

Rolling and plating shallow black nickel and nano graphene sealed coating structure comprises metal substrate, pre-plating copper layer, nickel plating layer, gun black plating layer and nano graphene sealing layer orderly prepared from inside to outside.

GUO C, WU M, LAI H

Bronze and nano graphene plating layer structure comprises metal substrate, cyanide pre-plating copper layer, middle copper plating layer, bright copper plating layer, bronze plating layer, black tin nickel alloy plating layer and graphene sealing layer.

GUO C, CHEN M, LAI H

Galvanized and hydroxyl graphene-sealed coating structure of cast iron piece comprises cast iron piece base body, acidic zinc plating layer, basic zinc plating layer, trivalent chromium passivation layer and nano graphene sealing layer.

GUO C, WU M, LAI H

Plating layer structure for rolling plating antique copper comprises metal substrate, copper plating layer, antique copper coloring layer and graphene sealing layer orderly prepared from inside to outside on metal substrate.

GUO C, CHEN M, LAI H

Cyanide-free cadmium-titanium alloy and graphene closed plating layer structure for aerospace fastener, comprises metal substrate, non-cyanide cadmium-titanium alloy plating layer, chromate low chrome color passivation layer and nano hydroxyl graphene closed layer.

GUO C, LAI H

Sealant for nickel-plated metal component, comprises graphene, graphene dispersant, two types of silica sol, water-soluble polymer resin emulsion, silane coupling agent, and water.

DOU H, ZHANG C, LI A

Preparation method of copper-coated graphene comprises mixing modified graphene slurry, soluble copper salt, sulfuric acid, chlorine ion additive, copper gloss additive and water to obtain plating liquid, plating, filtering, and passivating.

CHEN W, CAI M, LI J