国家/地区
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D005/50（2）
发明人
公开年 2022（2）
申请年 2021（2）
专利权人

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H