国家/地区
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D003/12（2） C25D021/18（2）
发明人 WANG M（2）
公开年
申请年 2021（2） 
专利权人 UNIV CHINA SCI TECHNOLOGY（2）

Electrolytic solution useful for metal nickel plating layer, comprises nickel ion, aqueous solution of borate ion and additive, where additive is used for promoting stripping of electroplating layer.

CHEN W, WANG M

Electrolytic solution used for electroplating substrate e.g. carbon carbon felt, comprises nickel ion, and aqueous solution of borate ion and additive that is used for promoting stripping of electroplating layer.

CHEN W, WANG M