国家/地区 美国（2）
IPC部 B（2）
IPC大类 B23（2）
IPC小类 B23K（2）
IPC C25D007/00（2）
发明人
公开年
申请年 2022（2）
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Manufacture of aerospace component involves treating surface of polymeric substrate with laser to form porous graphene at surface, and bonding metallic layer to porous graphene.

POTEET S, HUAPAYA R L N, BORDAGE K R, ROJAS HUAPAYA L N, ROJAS L N R