国家/地区 中国（2）
IPC部 B（3） C（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B009/00（2） B32B009/04（2） B32B037/00（2）
发明人
公开年 2021（3）
申请年 2021（3）
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Forming adhesively bonded structure used as building infrastructures, by applying primer compound comprising functionalized nanomaterial dopant to substrate, drying primer compound on substrate, applying adhesive compound over primer layer, contacting adhesive layer with substrate, and curing.

SMITH B A, POTEET S A, PUJAR V V

Preparing high toughness layered titanium-based composite material comprises e.g. depositing graphene oxide and silicon powder on titanium foil of cathode, stacking surface co-deposition graphene oxide-silicon coating layer and sintering.

HUO W, LEI C, WU H, LI L, CHANG G, LI X, ZHANG Y