国家/地区 美国（3）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3）
IPC C23C014/34（3）
发明人
公开年 2016（2）
申请年 2016（3）
专利权人

High-conductivity electrical interconnect structure for electrically interconnecting electrical components, has metallic overlay portion that connects peripheral edges of graphene elements with each other.

TANIELIAN M H

Method for synthesizing multi-layer graphene e.g. trilayer graphene, involves heat-treating catalytic metal layer on substrate while supplying methane gas, and synthesizing multi-layer graphene on heat-treated catalytic metal layer.

HAM M, SON M, HAM M H, SON M W, XIAN W, SUN M

Manufacturing method of graphene layer on substrate, involves exfoliating metalized graphene layer from first substrate and laminating metalized graphene layer to second substrate.

ZARETSKI A, LIPOMI D J