国家/地区 美国（3）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3）
IPC
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Aircraft engine component used as gearboxes, comprises wall comprising aluminum alloy and/or magnesium alloy, and protective coating comprising prime layer, silicone elastomer layer and abrasion resistant layer covering surface of wall.

IURLARO S, GARGIOLI A, GARABELLO M, GAROFALO S, GILARDI E, PICA O, ARGENTIERI G

Preparation method of carbon material used in e.g. micro-circuit, involves obtaining carbon material on surface substrate when conductive medium is solid substrate.

DONG Q, BAI W, CHU D, HE Y