国家/地区 美国（2）
IPC部 C（2）
IPC大类 C23（2） C25（2）
IPC小类 C23C（2）
IPC C25D005/54（2）
发明人
公开年 2017（2）
申请年
专利权人

High-conductivity electrical interconnect structure for electrically interconnecting electrical components, has metallic overlay portion that connects peripheral edges of graphene elements with each other.

TANIELIAN M H

Producing highly conducting film of highly oriented conductor-bonded graphene sheets, useful in thermal management device, comprises e.g. preparing graphene dispersion having discrete graphene sheets dispersed in fluid medium.

ZHAMU A, JANG B Z