国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D021/12（3）
发明人
公开年 2023（3）
申请年 2022（2） 
专利权人

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

Method for preparing high heat-conductivity graphene film, involves using single-layer or graphene sheet to weave graphene fiber filament, spinning fiber bundle composed of multiple graphene fiber filaments into fiber line, and weaving into graphene grid cloth.

SUN B