国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC C25D005/02（2）
发明人
公开年
申请年
专利权人

Segmented annular wire saw for cutting e.g. crystal silicon, has annular bus, where external surface annular bus is interval with multiple sand plating sections, and chip discharging groove formed between adjacent two sand plating sections.

YOU L, ZHANG Y, GONG Y

Electronic component three-dimensional (3D) printing device based on selective electro-deposition comprises x-axis moving device, y-axis moving device, and z-axis moving device which are all mounted on mounting support.

WU W, WANG J, GUO J, LIU T, ZHAO J