国家/地区 美国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人
公开年 2021（2）
申请年 2019（2）
专利权人

Corrosion inhibition on substrate, involves applying sealing solution comprising nanomaterial dopant to anodized surface of substrate, and drying sealing solution on substrate to form sealing layer comprising corrosion inhibiting compound.

STEELE L, PUJAR V V, SMITH B A, POTEET S A

Conductive slurry for plating circuit board, comprises carbon material containing carbon nanotube and/or graphene, dispersant and binder, which are uniformly mixed in solvent.

CHIU C, HUANG C