国家/地区
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3）
IPC C23C016/26（2） H05K007/20（2）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Method for manufacturing thermal conductive plate, involves attaching good thermal conductor containing hydrophilic graphene to surface of reinforcing portion and/or shell to form film-like hydrophilicity adhesion layer.

WU C M

Method for manufacturing diamond-graphene hybrid thermal management material, involves converting predetermined thickness of partial area of one side or both sides of diamond base material into vertical graphene, where diamond base material serves as heat spreader.

JU H, LEE J K, SU J

Gas and liquid heat exchange anti-corrosion printed circuit board heat exchanger, has heat exchanger core body provided with first heat exchange plate substrate, and fluid flow passage connected between first and second heat exchange plate.

LIN X, YIN L, WANG Q, SU W