国家/地区 韩国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC
发明人
公开年 2022（2）
申请年
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

High thermal conductivity and low gas permeability fluororesin tube useful for heat exchanger comprises fluororesin, thermally conductive flat filler and filler in form of nano-sized thermally conductive fibers.

CHOI J H