国家/地区 中国（2）
IPC部 F（2） H（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC F28D015/04（2）
发明人 CHEN Y（2）
公开年
申请年
专利权人

Directional hydrophobic structure for electronic packaging drainage device, has directional hydrophobic spacer that is arranged on substrate, and micro-grooves that are discharged into packaging mold along tapered micro-pillars.

LI B, GUO Y, XIE B, WEN G, CHEN Y, OU Z, HOU M

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A