国家/地区 中国（3）
IPC部 F（3）
IPC大类 F28（3） G06（2） H01（2）
IPC小类 F28D（3）
IPC F28D015/02（2） F28F021/02（2） G06F001/20（2）
H01M010/617（2） H01M010/623（2） H01M010/6555（2）
发明人 ZHENG Z（2） ZHONG M（2）
公开年 2022（3）
申请年 2022（3）
专利权人 LAUREL ELECT.（2）

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Directional hydrophobic structure for electronic packaging drainage device, has directional hydrophobic spacer that is arranged on substrate, and micro-grooves that are discharged into packaging mold along tapered micro-pillars.

LI B, GUO Y, XIE B, WEN G, CHEN Y, OU Z, HOU M